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Guangzhou Kaijin Precision Manufaturing Co., Ltd.
LED Headlight Bulb, LED Car Interior Light, PCB Fabrication,PCB Assembly, PCB design, PCB Prototype,HDI PCB, Multilayer PCB, Flexible PCB manufacturer,PCBA Assembly,PCBA,
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GSM Wireless Communication Module Printed Circuit Board Assembly Services

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Guangzhou Kaijin Precision Manufaturing Co., Ltd.
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GSM Wireless Communication Module Printed Circuit Board Assembly Services

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Brand Name : KAIJIN

Model Number : X-158763

Certification : ISO9001,ISO14001,ROHS,CQC

Place of Origin : Guang Dong CHINA

MOQ : 100

Price : Bargain

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 1000

Delivery Time : 5-7 work days

Packaging Details : Full Type of packaging

Min. line width : 0.1mm

Base material : FR-4/Aluminum

Min. line spacing : 4/4mil(0.1/0.1mm)

Board thickness : 0.2mm--3.2mm

Surface finishing : OSP

Copper thickness : 1/2OZ 1OZ 2OZ 3OZ

Min. hole size : 0.1mm(4mil)

Hole : 0.20mm

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Customized GSM wireless communication module PCB assembly manufacturer

Product parameters

Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

Company Introduction

Guangzhou Kaijin Precision Manufacturing Co., Ltd. is a focus on the electronics industry SMT/DIP high-end circuit board processing, the company has 60 employees, the existing high-speed patch production line four, 3 new YAMAMHA patch lines, a total of 6 machines, 1 SONY patch production line a total of 2 sets, offline AOI inspection equipment 4 sets, daily average patch production capacity of 6 million points, plug-in production lines 2, tin production line 2, new lead-free wave soldering, daily average production capacity of 1.2 million points, Lead-free assembly 30-meter production line 2, daily assembly of about 3,000 products, peripheral auxiliary equipment is perfect, can ensure the integrity of product quality, many places to achieve automated processes, for customers
For qualified products!

GSM Wireless Communication Module Printed Circuit Board Assembly ServicesGSM Wireless Communication Module Printed Circuit Board Assembly ServicesGSM Wireless Communication Module Printed Circuit Board Assembly Services


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GSM Communication Module

      

Communication Printed Circuit Board Assembly Services

      

ODM Printed Circuit Board Assembly Services

      
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