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Guangzhou Kaijin Precision Manufaturing Co., Ltd.
LED Headlight Bulb, LED Car Interior Light, PCB Fabrication,PCB Assembly, PCB design, PCB Prototype,HDI PCB, Multilayer PCB, Flexible PCB manufacturer,PCBA Assembly,PCBA,
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SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

Guangzhou Kaijin Precision Manufaturing Co., Ltd.
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SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

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Brand Name : KAIJIN

Model Number : PCBA

Certification : ISO 9001:2015

Place of Origin : China

MOQ : 100+

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 6000

Delivery Time : 10

Packaging Details : Fully featured

Processing type : customized

Processing method : any way

Processing equipment : high-speed placement machine, reflow soldering, wave soldering, AI, AOI, X-RAY, etc

Quality certification : standard integration management system, ISO9

Number of processing equipment : 50 sets

Number of production lines : 5

Daily processing capacity : 6 million points

Lead-free manufacturing process : Yes

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SMT Chip Processing DIP Soldering Video Surveillance Terminal Motherboard

Product parameters

Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

SMT PCB Assembly And Soldering DIP Video Surveillance Terminal MotherboardSMT PCB Assembly And Soldering DIP Video Surveillance Terminal MotherboardSMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

Why did you choose us?
1,Experienced
Focused on PCBA electronic manufacturing for 8 years
Best Partner for Listed Companies
Serving over 60 European and American enterprises
Helping clients solve design issues over 500 times
Helped customers solve MP issues over 800 times.
Helping customers improve testing reliability over 1000 times
2,Quality control
ISO9001: 2015
ISO13485
IATF16949
MES
Traceability system
Fully automatic FCT testing
3,Quick response
Quick response principle within 1 hour
7 days * 24 hours
Team responsibility system
Sales personnel with a bachelor's degree or above


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